Heatsink Compound Thermal Paste  

Heatsink compound, also known as thermal paste or thermal compound, is a material used to improve the thermal connection between a computer’s processor (CPU or GPU) and its heatsink. Its primary purpose is to fill in microscopic air gaps and imperfections on the surfaces of the processor and heatsink, which helps in better heat transfer and prevents overheating.
Key points about thermal paste:
Composition: It usually consists of a base material such as silicone or ceramic, mixed with thermally conductive materials like metal oxides or particles. There are also higher-performance types containing materials like silver or copper.
Application: It’s applied in a thin, even layer between the processor and heatsink. The application process can vary depending on the paste and the specific needs of the system.
Performance: Thermal paste helps maintain optimal operating temperatures, which can enhance performance and longevity of the CPU or GPU. Poor application or old paste can lead to higher temperatures and potentially reduce system stability.
Maintenance: Over time, thermal paste can degrade or dry out, reducing its effectiveness. It’s often recommended to reapply thermal paste during major system maintenance or when upgrading components.
Types: There are different types, including silicone-based, ceramic-based, and metal-based. Each type has different thermal conductivity levels, viscosity, and ease of application.
Using the right type of thermal paste and applying it correctly is crucial for efficient heat management and ensuring that your system runs smoothly.